Capability Overview:

At Vortex we specialise in the dicing of optical components and coated wafers, we can dice wafers or substrates up to 150 mm in diameter or length and between 0.1 and 4 mm thick. We are able to dice parts to a finished size as small as 1.0 x 1.0 mm with +/- tolerance of 0.1mm as standard. We can dice a range of materials listed below:

  • Sapphire
  • Glass
  • Silicon
  • Quartz
  • Calcium Fluoride
  • Germanium

We are also able to do step dicing, however this is quoted on an individual basis so please contact us to discuss your specific requirements.

Wafer Dicing Table:

Here is a more detailed overview of our capabilities and the prices per wafer (up to 5 wafers). For quantities above 5 wafers please contact us directly for bulk pricing.

Substrate:

Tolerance:

Edge Chips:

Price (£) < 4.0 x 4.0 mm

Price (£) <4.0 x 4.0 mm

25.4 mm Ø Silicon

+/- 0.1 mm

> 0.1mm

£150.00

£175.00

25.4 mm Ø Germanium

+/- 0.1 mm

> 0.1 mm

£150.00

£175.00

25.4 mm Ø Glass

+/- 0.1 mm

> 0.1 mm

£150.00

£175.00

25.4 mm Ø Quartz

+/- 0.1 mm

> 0.1 mm

£175.00

£200.00

25.4 mm Ø Sapphire

+/- 0.1 mm

> 0.25 mm

£200.00

£225.00

25.4 mm Ø Sapphire Premium

+/- 0.1 mm

> 0.1 mm

£250.00

£300.00

 

 

 

 

 

100 mm Ø Silicon

+/- 0.1 mm

> 0.1 mm

£200.00

£300.00

100 mm Ø Germanium

+/- 0.1 mm

> 0.1 mm

£200.00

£300.00

100 mm Ø Glass

+/- 0.1 mm

> 0.1 mm

£200.00

£300.00

100 mm Ø Quartz

+/- 0.1 mm

> 0.1 mm

£250.00

£350.00

100 mm Ø Sapphire

+/- 0.1 mm

> 0.25 mm

£400.00

£500.00

100 mm Ø Sapphire Premium

+/- 0.1 mm

> 0.1 mm

£500.00

£600.00

Investing In the Latest Technology:

 

In 2021 we took delivery of a brand-new state of the art Disco dicing saw to work alongside our current saw. This has significantly increased our capacity to a point where we are now able to offer dicing as an external service, beyond the dicing of our own filters.

We have also recently invested in new, thinner diamond blades. This reduces the kerf losses from the blade cutting through the substrate, meaning more parts per wafer without compromise on the cut quality. 

 

Sapphire Dicing Edge Chips < 0.1 mm:

 

We have recently made some major improvements to our sapphire dicing processes through extensive trials of new processing methods. The main aim of this was to reduce edge chips when dicing sapphire to the same level as glass and silicon (0.1mm).

The dicing of sapphire has been an issue in the industry for quite some time, with many companies struggling to get pristine edges on sapphire parts. Sapphire is often chosen for optical components because of its tough robust make up, however this can make the dicing process somewhat tricky. The trials proved very successful, and we are now able to offer the dicing of sapphire to and edge chip specification of less than 0.1mm (100 µm).

 

Packaging Solutions:

We offer a range of different cost-effective packaging solutions to best integrate with production and assembly lines and pick and place robots. We can ship parts on UV cured dicing tape, Entegris Trays, Waffle Trays, Plastic Frame Mounts or Individually Wrapped or Bagged. Please discuss with us to find the most appropriate solution for your specific requirement.

 

UV Cured Tape

Entegris Trays

Waffle Trays

Frame Mounts

Wrapped

Hexagonal Dicing:

 

Whilst the majority of diced filters remain to a standard square or rectangle we have noticed a significant increase in the requirement for hexagonal filters. One of the reasons for this is that they are more suited to circular housings and instruments than square filters. The main benefit is that diced components are almost always cheaper than bespoke round windows or core drilled parts from wafers, hexagons offer the best of both worlds with a more rounded shape whilst also being cost effective.